*** Layer info for Hypres 4.5kA/cm2 process - Calibrated for Mask Aligner
*** Author: Coenrad Fourie
*** Last Modification: 10 August 2013
*** Info: Updated default sigma and descriptions
*
$Parameters
* Global parameters
*  Units is the units used in input files PER METRE. This can be changed to handle large-scale modelling
*    For IC applications (RSFQ circuits), keep Units = 1e-6 (1 micron)
Units             =  1e-6
*  CIFUnitsPerMicron lets InductEx know the CIF coordinate scale
*    If your layout tool puts out CIF files with 100 units per micron (default), use 100
*    If your layout tool uses 1000 units per micron (XIC if not stripped for export), use 1000
*    If you have no idea what this means, keep CIFUnitsPerMicron = 100
CIFUnitsPerMicron =  100
AbsMin            =  0.001
GapMax            =  2.5
GPOverhang        =  2.5
ProcessHasGroundPlane = TRUE
ZSegsToEC         =  FALSE 
ZSegsToEC         =  TRUE
JoinShortSegments =  TRUE
LastDieLayerOrder =  10
GPLayer           =  30
BlankAllLayer     =  60
BlankXLayer       =  61
BlankYLayer       =  62
TermLayer         =  63
TextLayer         =  64
Lambda            =  0.09
Sigma             =  10
HFilaments        =  1
Colour            =  1
TerminalInRange   =  1.0
$End
*
* LAYERS
** Number is GDS layer number
** Name is layer as applied in geometry input file
** Bias is the mask-wafer offset of an object's border in this layer
** Thickness is the layer thickness in microns
** Lamba is the layer's penetration depth in microns (overrides global Lambda)
** Sigma is the layer's bulk conductivity in 1/(Ohms_per_square*UnitSize_in_metres) - overrides global Sigma
** Order is the layer's order during wafer construction - the lowest layer starts at 0, but does not need to be Ground (as in ADP)
** Mask is the mask polarity: {1 = layer objects define material
**                             0 = layer objects not translated to model
**                            -1 = layer objects define cutots }
** Filmtype is the layer material typ: {S = superconductor, N = normal conductor (not segmented), I = isolator, R = resistor, 
**                                      A = auxiliary/don't care}
**    ! See User Manual for difference between N (normal conductor) and R (resistor) for modelling purposes
** HFilaments is the number of filaments segments are divided into over the height (overrides global HFilaments)
** GapMax is the largest dimension of any segment that will not be subdivided into equal-sized smaller segments (overrides global GapMax)
** LayerADD is the number of a layer of which objects are added to current layer (OR operation)
** LayerSUB is the number of a layer of which objects are subtracted from the current layer
** Colour is the DXF colour (for viewing purposes)
**
*
* M0
$Layer
Number     =     30
Name       =     M0
Bias       =     0.2
Thickness  =     0.1
Lambda     =     0.078
Order      =     0
Mask       =    -1
Filmtype   =     S
HFilaments =     1
Colour     =     130
$End
*
$Layer
Number     =     1
Name       =     M1
Bias       =     0.015
Thickness  =     0.135
Lambda     =     0.112
Order      =     2
Mask       =     1
Filmtype   =     S
HFilaments =     2
Colour     =     10
$End
*
$Layer
Number     =     6
Name       =     M2
Bias       =    -0.1
Thickness  =     0.3
Lambda     =     0.0975
Order      =     7
Mask       =     1
Filmtype   =     S
HFilaments =     3
Colour     =     182
$End
*
$Layer
Number     =     10
Name       =     M3
Bias       =     -0.05
Thickness  =     0.6
Lambda     =     0.110
Order      =     9
Mask       =     1
Filmtype   =     S
HFilaments =     3
Colour     =     160
$End
*
* I0
$Layer
Number     =     31
Name       =     I0
Bias       =     0.2
Thickness  =     0.15
Order      =     1
Mask       =    -1
Filmtype   =     I
$End
*
* I1C
$Layer
Number     =     4
Name       =     I1C
Bias       =     0
Thickness  =     0.05
Order      =     3
Mask       =     0
Filmtype   =     A
$End
*
* I1B
$Layer
Number     =     3
Name       =     I1B
Bias       =    -0.1
Thickness  =     0.19
Order      =     6
Mask       =    -1
Filmtype   =     I
LayerSUB   =     9
* We subtract layer 9 (R2) from I1B to eradicate I1B vias to resistors that will
* short to M1 otherwise (all normal layers are discarded during segmentation, thus
* removing them from the z-directed stack for connectivity checking).
$End
*
* I2
$Layer
Number     =     8
Name       =     I2
Bias       =     0.2
Thickness  =     0.495
Order      =     8
Mask       =    -1
Filmtype   =     I
$End
*
* R2
$Layer
Number     =     9
Name       =     R2
Bias       =     0
Thickness  =     0.07
Sigma      =     6.8027
Order      =     5
Mask       =     1
Filmtype   =     N
$End
*
* R3
$Layer
Number     =     11
Name       =     R3
Bias       =     0
Thickness  =     0.35
Sigma      =     10
Order      =     10
Mask       =     1
Filmtype   =     N
$End
*
* A1
$Layer
Number     =     5
Name       =     A1
Bias       =     0
Thickness  =     0.04
Order      =     4
Mask       =     0
Filmtype   =     A
$End
*
* TERM
$Layer
Number     =     63
Name       =     TERM
Bias       =     0
Thickness  =     0.1
Order      =     11
Mask       =    -4
$End
*
* OPERATORS
** Define operators here
*
$Operator
Name            =     GPM3M0
Type            =     EC
LayersRemove    =     1 6 31 4 3 8 9 5
LayersConnect   =     30 10
$End
*
$Operator
Name            =     GPM3M2
Type            =     EC
LayersRemove    =     8 9
LayersConnect   =     6 10
$End
*
$Operator
Name            =     GPM1M0
Type            =     EC
LayersRemove    =     31
LayersConnect   =     1 30
$End
*
$Operator
Name            =     SQJJ
Type            =     MR
LayersTransform =     3 4 5
$End